尊敬的客户

您好!

Semicon China 2008将于今年3月18日到3月20日在上海新国际展览中心举办. 届时, 株式会社东京精密将参展, 并展出划片机A-WD-300TX实物，展示探针台、硅片倒角机、CMP、硅片表面缺陷检查装置WIN-WIN50和硅片背面减薄抛光设备PG图片及DVD。欢迎莅临参观指导.
东京精密展台号: W2 2401
株式会社东京精密
东精精密设备(上海)有限公司

LETTER OF INVITATION
Dear Customers,

Semicon China 2008 will be held from 18, Mar to 20, Mar, at Shanghai New Expo Center in Shanghai. ACCRETECH -Tokyo Seimitsu Co., Ltd will show the real products of Dicing Saw A-WD-300TX and exhibit the products of Edge Grinding Machine, CMP, polishing grinder, wafer inspection machine by panel and DVD.

ACCRETECH sincerely invite you attain the exhibition and visit our booth at W2 2401.

ACCRETECH – Tokyo Seimitsu Co., Ltd.
ACCRETECH (CHINA) CO., LTD.